10 years  (1984 - 1993) PCB Process - and Development Eng.

Development Mgr for new PCB processes

Soldermask, Dry Film, DES, Finishes, ET, AOI, Registration

Introduction of the latest new technologies among others

• 3,4,5 track density
• Buried Via Technology
• Buried Resistor Technology
• SMOBC, Cu Ni Sn
• OSP Technologie
• µvia Technologie (Plasma and Laser)
• Water based Photoresist

• Water based Soldermask
• 4 slot registration System
• Electrophoretic Photoresist
• New Laminates (Cyanate Ester, high speed, high reliability)
• Electrical characterization of PCB´s
• Direct Plating
• Optical Imaging, LDI
• Laser Technology, Plasma
• Ink Jet Printing for nomenclature etc.

Construction of a new PCB plant with 100 Mio DM investment in 1989/90 in Boeblingen for HP

• Definition of all processes and equipment