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HP 
1984 - 1998
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10 years  (1984 - 1993) PCB Process - and Development Eng.


Development Mgr for new PCB processes


Soldermask, Dry Film, DES, Finishes, ET, AOI, Registration


Introduction of the latest new technologies among others


  • 3,4,5 track density
  • Buried Via Technology
  • Buried Resistor Technology
  • SMOBC, Cu Ni Sn
  • OSP Technologie
  • µvia Technologie (Plasma and Laser)
  • Water based Photoresist