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Home 1979


1983


1984


Process Engineer
Area: Screen Printing, Solder-mask,
Electrical Test, AOI, Imagung, Develop,
Etch and Strip, Resist Waste Water etc.

1986


1987


1989


1990

1994


1997

R&D Project Mgr. Hewlett Packard USA 
“Electronic Assembly Development 
Center’’ 
Palo Alto California (HP Labs)
Focus: 
Reliability of PCB Assemblies
and Advanced Flip Chip Technology
Business Development Manager HP
Boeblingen
Special Project: Selling the PCB Factory
in Boeblingen to the Dii Group 
Establishment of the company 
Multek Europe = Multilayer Technology
GmbH & Co. KG Boeblingen, the 
German subsidiary of Multek
1998


2002

2003

Hewlett Packard GmbH Boeblingen, Printed Circuit Board Division
Field Application - Director 
responsible for costumers 
worldwide for Multek Global
2004

2007

Program Manager and Director for 
RoHS (Restriction of Hazardous 
Substances) and lead free soldering 
for the successful transition lead free
technology in Multek
2010

2013

Vice President Multek Technology and
Engineering as part of the Multek 
Printed Electronics Group (Flexible
Circuits, Displays, Touch Solutions)
New Business Development (Touch,
Displays, Solar, RFID, Glucose 
Sensors etc.)
today